DARPA launched Phase 1 of its Robust Quantum Sensors (RoQS) program, a groundbreaking effort to develop and deploy quantum sensing technology. Quantum sensors ...
A new platform developed by Illinois Grainger engineers demonstrates the utility of a ytterbium-171 atom array in quantum ...
Scandiano, September 3, 2025 – E4 Computer Engineering, an Italian company in the field of high-tech hardware and software solutions for high-performance computing, artificial intelligence, and ...
A case study in aerospace manufacturing provides an overview of how physics-informed digital twin systems transform robotics processes—from adaptive process planning and real-time process monitoring ...
Key market opportunities in agentic AI in digital engineering include the need for faster innovation, managing complexity, and harnessing rapid AI advancements. Growth is spurred by integration with ...
Next-generation semiconductor products increasingly rely on vertical integration technologies to drive system density, speed, and yield improvement. Due to the increased coupling effects across ...
The idea that more functionality can be added into a single chip, or even into a single system, is falling out of vogue. For an increasing number of applications, it’s no longer considered the best ...
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