NIMS, in joint research with the University of Tokyo, AIST, the University of Osaka, and Tohoku University, have proposed a ...

Zero-thermal-expansion (ZTE) materials are widely used in precision optics, cryogenic equipment and sensors, where even small ...

This Application Note illustrates the power dissipation and thermal transfer through the semiconductor package using thermal resistance model, which is critical in considering thermal management to ...

This application note discusses the measurement process and the report of the thermal performance of a small outline SO-5 package. This process used a low conductivity test boards as per JEDEC ...

Higher power density, smaller form factors and long-life reliability expectations all collide, requiring better thermal ...

Increasing electronic packaging density leads to a greater need for precise thermal management. Hence, for electrical ...

With the increasing waste heat production by today’s electronics in ever smaller spaces, drawing this heat away quickly enough to prevent thermal throttling or damage is a major concern. This is where ...

Using these natural designs as a guide, the team built a laminated composite made of alternating layers of pure copper foil ...

Inspired by hierarchical structures found in nature, a research team from the Hefei Institutes of Physical Science of the ...