Generative Golden Reference Hardware Fuzzing” was published by researchers at TU Darmstadt. Abstract “Modern hardware systems ...
A new technical paper titled “Making Strong Error-Correcting Codes Work Effectively for HBM in AI Inference” was published by researchers at Rensselaer Polytechnic Institute, ScaleFlux and IBM T.J.
What chip industry engineers were watching this year.
Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
Advanced packaging technologies are reshaping how compute platforms are conceived, optimized, and manufactured.
Researchers from the University of Southern California Information Sciences Institute and the University of Wisconsin-Madison ...
Designers are utilizing an array of programmable or configurable ICs to keep pace with rapidly changing technology and AI.
Thermal Modeling in Emerging Heterogeneous 2.5D/3D Systems (EPFL, Universidad Complutense de Madrid)
Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems” was published by researchers at EPFL and ...
As chip designs become larger and more complex, especially for AI and high-performance computing workloads, it’s often not ...
Ensuring that verification platforms can scale with industry demands and support new use cases as they emerge.
A new technical paper titled “A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, ...
A new technical paper titled “LLM-based Behaviour Driven Development for Hardware Design” was published by researchers at ...
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