Abstract: This paper proposes a high-power-density 150 GHz phased-array transceiver designed for 6G user equipment (UE) modules, utilizing $65-\text{nm}$ CMOS technology. An 8 -element AiP module ...
Abstract: Thermo-sensitive electrical parameters (TSEPs) are widely used for estimating the junction temperature of power semiconductors, with the prerequisite that the relationship model between ...
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